How Thick Film Hybrids are Manufactured

Thick film technology is primarily used for the production hybrid integrated circuits and sensors for Hi-tech industries. It is also used for the production of electronic devices like surface mount devices. Primarily the hybrid circuits made by this technology are used in the locomotive industries in the sensors, mixture of air/fuel, gearbox controls, ignitors, airbags etc.

These thick circuits should be highly reliable as any wear or tear in these circuits can lead to a massive loss. It is due to this reason that manufacturing of these circuits is an intricate process that is carried out meticulously with an utmost care by the manufacturer. It consists of several steps involving deposition of numerous successive layers of the conductor, dielectric layers, and resistors onto a substrate which is electrically insulated via a method known as screen printing.

Thick film hybrid is processed in the following stages.

Substrate Lasering:

Primarily, the substrates are comprised of 96% aluminum oxide which is also known as alumina which is very hard and hence LASERING is the best way to machine. With the help of lasering it is possible to profile, scribe and drill holes. Lasering of the substrate before processing is efficient and has a cost benefit over dicing using the diamond saw technology.

Preparation of Ink:

Electrodes, terminals, dielectric layers etc. all need ink which is manufactured by mixing metal or ceramic powders needed with an organic vehicle that can produce a paste like substance for the screen printing.

Screen Printing:

It is a process of transferring ink with the help of a woven mesh screen or simply with the help of a stencil.

Drying Process:

Once the printing is done and the ink gets settled, each layer of the deposited ink is dried at a moderately high temperature ranging from 50 to 200 degree centigrade. For the inks based on polymers drying is sufficient but there are certain inks that need curing with the help of Ultra-violet light.

Firing for Fixing Layers:

For metals like glass inks, ceramic and metal that are used in the thick film processes, a very high temperature (more than 300 degree) is needed. This will fix the layers eternally on the substrate.

The next steps comprises of laser trimming of resistors, mounting of capacitors semiconductors, separation of the elements and finally integration of the devices. The last step is the most important one and needs a lot of meticulous care. It is important to choose a dependable and reputed hybrid PCB manufacturer in New Jersey or anywhere else to make sure the smooth functioning of the electronic devices in the industry as any wear and tear can lead to huge loss of capital. Rely on your own market research and choose the best one for you. 

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Created on Jun 21st 2018 05:21. Viewed 348 times.

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