A Short Guide To know About Thick Film Circuit Board

The "Thick Film" alludes to the thickness of conductor layer on Ceramic PCB. Regularly the thickness will be at any rate surpasses 10 miron (um), around 10~13um, more thick than spurting innovation in Thin Film Ceramic PCB. Obviously thickness is not as much as DCB Ceramic board or FR4 board. 

In the meantime, utilizing thick film innovation, we can put resistor, electric limit, channel, semi-conduit, and interchangeable conveyor on fired load up, in the wake of assembling ventures of printing and high temperature splintering. We can make every one of the resistors with a similar esteem, or distinctive incentive for various resistor on a similar board. 

Fundamental Parameter of Thick Film Ceramic Board: 

•Substrate can be 96% or 98% Alumina (Al2O3) or Beryllium Oxide (BeO), thickness run: 0.25, 0.38, 0.50mm, 0.635mm (default thickness), 0.76mm, 1.0mm. Thicker thickness, for example, 1.6mm or 2.0mm can be tweaked as well. 

•Conductor layer material is silver palladium, gold palladium, or Mo/Mu+Ni (for Ozone); 

•Thickness of conductor >= 10 miron (um), and Max can be 20 micron (0.02mm) 

•Min follow width and space for volume production: 0.30mm and 0.30mm, 0.20mm/0.20mm is additionally alright yet cost will be higher, and 0.15mm/0.20mm accessible for model. 

•Resilience for definite follow format will be +/ - 10% 

•Both gold and silver palladium is workable for gold-wire holding, however client need to say that so we will utilize unique silver palladium which is appropriate for that craftsmanship. 

•Gold palladium is significantly more costly than silver, around 10~20 times higher 

•More extraordinary resistor esteem on a similar board, more costly board will be 

•Ordinarily layers are 1L and 2L (with plated through gap (PTH), and plated material is a similar like the one utilized for conductor), and greatest layers can be 10 layers 

•Just board with Rectangle shape can be delivered through single piece, or by means of board 

•Soldermask is likewise accessible upon ask for, working temperature >500 C, and shading is semi-straightforward 

•For same stack up, cost lower than DCB, higher than MCPCB

Applications where Thick Film Circuit Boards are used: 

•High-Power LED

•Chip, Wafter

•Street Light, High Bright Light

•Automotive Light System

•Hybrid Integrated Circuit For Automotive

•Fuel Sendor Resistor Card

•Injection System

•Anti-Block Braking System

•High-Power Electronic Semi-Conductor Module

•Electric Power Transmitter Modules

•Semiconductor Process Equipment

•Solar Cell

•Sensor

•Telecom Device

A Hybrid Multilayer PCB uses materials with significantly different critical properties than those associated with a traditional multilayered. A hybrid could use a mix of FR-4 materials with high-frequency materials, or a mix of different high-frequency materials with different dielectric constants. Hybrid construction is becoming more popular as technology evolves, but they bring with them some benefits and challenges which need to be better understood.

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Created on Mar 23rd 2018 07:13. Viewed 503 times.

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