What is the PCB flying Probe Test
Flying probe test is one of the methods to check the electrical function of PCB.Flying testing machine is a system in a manufacturing environment test PCB copy board. Not used in traditional online testing machine all traditional neilsbed bed-of-nails interface, PCB flying probe test using four to eight independent control of the probe, the move components to the test.
In measuring unit (UUT, the unit under test through a belt or other UUT transmission system transported to test machine. And then fixed and testing machine contact probe test pads (test pad) and via holes (via) to test in the test (UUT) unit and individual components.
Test probe by multiplex (multiplexing) system connected to the drive signal generator, power supply, and so on) and the sensor (Digital million table, a frequency counter, etc.) to test the UUT on components. When a component is testing, other components of the UUT through probe is in electrical shielding to prevent interference of reading. Flying probe test is a must needing process when producing PCB by China PCB Manufacturers.
Steps for the production of a flying Probe test program
1. Import layer file, inspection, arrangement, alignment, then the two outer lines change the name for the inner fronrear. change the name for the ily02, ily03, ily04neg (if it is negative, the rear, the rearmneg.
2.Adding three layers, respectively, the two solder resist layer and drilling layer copied to the increase of the three layer, and changed the name to fronmneg, rearmneg, mehole. can be named as met01-02., met02-05, met05-06, and so on.
3. To copy the past rearmneg, fronmneg two layer to change the D code for the round. 8mil we call the fronmneg before the test point, the rearmneg is called the back of the test point.
4. Remove the npth hole, the control line to find the via hole, define the hole.
5. Fron, mehole as reference layer and fronmneg layer is changed to on, for check take a look at the test points are in front layer line opening. Greater than 100 Mil hole test points to move to the girth welding test. Test points at the BGA too dense to dislocation. Can be appropriate to delete some much more than the intermediate test point. Back operation.
6. To collate the test point fronmneg copy to the fron layer, the rearmneg copy to the rear layer.
7. Activate all of the layers and move to 10,10mm.
8. The output Gerber file is named fron, ily02, ily03, ily04neg, ilyo5neg, rear, fronmneg, rearmneg, mehole, met01-02, met02-09,, and met09-met10, and then use ediapv software
In measuring unit (UUT, the unit under test through a belt or other UUT transmission system transported to test machine. And then fixed and testing machine contact probe test pads (test pad) and via holes (via) to test in the test (UUT) unit and individual components.
Test probe by multiplex (multiplexing) system connected to the drive signal generator, power supply, and so on) and the sensor (Digital million table, a frequency counter, etc.) to test the UUT on components. When a component is testing, other components of the UUT through probe is in electrical shielding to prevent interference of reading. Flying probe test is a must needing process when producing PCB by China PCB Manufacturers.
Steps for the production of a flying Probe test program
1. Import layer file, inspection, arrangement, alignment, then the two outer lines change the name for the inner fronrear. change the name for the ily02, ily03, ily04neg (if it is negative, the rear, the rearmneg.
2.Adding three layers, respectively, the two solder resist layer and drilling layer copied to the increase of the three layer, and changed the name to fronmneg, rearmneg, mehole. can be named as met01-02., met02-05, met05-06, and so on.
3. To copy the past rearmneg, fronmneg two layer to change the D code for the round. 8mil we call the fronmneg before the test point, the rearmneg is called the back of the test point.
4. Remove the npth hole, the control line to find the via hole, define the hole.
5. Fron, mehole as reference layer and fronmneg layer is changed to on, for check take a look at the test points are in front layer line opening. Greater than 100 Mil hole test points to move to the girth welding test. Test points at the BGA too dense to dislocation. Can be appropriate to delete some much more than the intermediate test point. Back operation.
6. To collate the test point fronmneg copy to the fron layer, the rearmneg copy to the rear layer.
7. Activate all of the layers and move to 10,10mm.
8. The output Gerber file is named fron, ily02, ily03, ily04neg, ilyo5neg, rear, fronmneg, rearmneg, mehole, met01-02, met02-09,, and met09-met10, and then use ediapv software
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