Printed Circuit Board 3D Printing New Technology
Reuters ofweek3d print 2016 on March 28, 3D printing electronic field of well-known enterprises nano dimension announced that the company a wholly owned subsidiary of nano dimension technologies has been to the United States Patent and Trademark Office submitted a patent technology application, the patent application relates to technology for in a printed circuit board PCB manufacturer print of the shielded wire method.
It is understood that the patent application for the printed circuit board of the power loss phenomenon presents a solution, the technology is mainly used in the communication industry.
It is well known that the communications industry requires high speed data transmission, the current high speed circuit transmission speed can reach 60g - 100g. The industry of PCB often suffer losses because of a conductive line crosstalk and because of the diversity of signal and the phenomenon. But the loss phenomenon from the normal function of the circuit interference.
To solve this problem, the nano dimension have developed a unique 3D printing method, the method to create a 3D printing layer of protection to shield conductor, like an insulated cables as, and the new 3D printing process can be planted to a printed circuit board.
This innovative approach creates the opportunity to minimize the size of the printed circuit board used in the field of high speed communications.
By selectively depositing nano size conductive ink, manufacturers can in the smallest distance along the length of the wire generates a shield, which can prevent leakage and loss of. This is somewhat similar to use shielded cable in the outside of the printed circuit. But 3D printing technology realized the shielding cable embedded (printed circuit board).
High speed circuit board is an essential part of the telecommunication industry, and it is also an important part of the real time big data.
Further Reading:
PCB Circuit Board Fabrication Process Flow
It is understood that the patent application for the printed circuit board of the power loss phenomenon presents a solution, the technology is mainly used in the communication industry.
It is well known that the communications industry requires high speed data transmission, the current high speed circuit transmission speed can reach 60g - 100g. The industry of PCB often suffer losses because of a conductive line crosstalk and because of the diversity of signal and the phenomenon. But the loss phenomenon from the normal function of the circuit interference.
To solve this problem, the nano dimension have developed a unique 3D printing method, the method to create a 3D printing layer of protection to shield conductor, like an insulated cables as, and the new 3D printing process can be planted to a printed circuit board.
This innovative approach creates the opportunity to minimize the size of the printed circuit board used in the field of high speed communications.
By selectively depositing nano size conductive ink, manufacturers can in the smallest distance along the length of the wire generates a shield, which can prevent leakage and loss of. This is somewhat similar to use shielded cable in the outside of the printed circuit. But 3D printing technology realized the shielding cable embedded (printed circuit board).
High speed circuit board is an essential part of the telecommunication industry, and it is also an important part of the real time big data.
Further Reading:
PCB Circuit Board Fabrication Process Flow
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