COB Encapsulation Materials Based on Chip Underfill

Its latest capillary-flow underfills are high-purity, one-component pot materials with high fluidity. DeepMaterial offers capillary-flow underfills for CSP devices, flip chips, and BGAs. By forming uniform underfill layers and eliminating solder stress, they improve component reliability and mechanical properties. DeepMaterial is capable of filling extremely fine pitch parts quickly, has a high cure rate, is highly workable, long-lasting, and rework able. When rework ability is available, the underfill can be removed and refilled, saving you money.

CSP or BGA assemblies may require an underfill to improve mechanical integrity during flexing, vibration, or drop testing to ensure extended thermal life and long cycle life. Flip chip assemblies require stress relief at the welding seam.

There are several filler levels in DeepMaterial's Based Chip Underfill, including high filler content, fast flow, and high modulus. In addition to high glass transition temperatures, high modulus, and high glass transition temperatures, CSP underfelts are available in a variety of filler levels. A glass transition temperature and module are selected for each level.

As well as protecting wire bonds, COB can also increase their mechanical strength. Gap filling, cofferdams, and top encapsulation are used to seal wire-bonded chips. Adhesives should have fine-tuning flow functions to ensure that wires are protected and that adhesive does not leak from the chip. Fine pitch leads are also possible.

COB encapsulating adhesives from DeepMaterials may be heat cured or UV cured with high reliability. DeepMaterials' waterproofing adhesives for COB protect silicon wafers and leads from mechanical and chemical damage.

Developed by DeepMaterial, COB Encapsulating Adhesives provide excellent electrical insulation thanks to heat-curing epoxy and UV-curing acrylic chemistries. DeepMaterial COB Encapsulation Materials offer excellent high temperature stability and thermal stress resistance, good electrical insulation properties across a wide temperature spectrum, and low shrinkage properties.

As an innovative company in Shenzhen, DeepMaterial, Ltd., specializes in adhesives for semiconductors and other electronic applications, as well as surface protection materials for chip packaging and testing.

On the basis of its core adhesive technology, DeepMaterial has developed adhesives for chip packaging and testing, as well as circuit board-level adhesives and electronic product waterproof adhesives. The company has also developed semiconductor sealants, packaging materials, and protective films used in semiconductor processing. For more information, visit www.deepmaterialcn.com

To provide electronic adhesives and thin-film electronic application materials products and solutions for communication terminal companies, consumer electronics companies, semiconductor packaging and testing companies, and communication equipment manufacturers, as well as solve the above-mentioned customers' process protection, high-precision bonding, and electrical performance problems. Domestically produced protection, optical protection, etc., are substituted.

A variety of adhesive services are provided by Deepmaterial, including custom electronic adhesives, PUR structural adhesives, UV moisture curing adhesives, epoxy adhesives, conductive silver glue, epoxy underfill adhesives, epoxy encapsulates, functional protective films, semiconductor protective films, and epoxy encapsulates. Our company developed and applied glue to consumer electronics, medical equipment, aerospace, optoelectronic energy, auto parts, and semiconductor chips. R&D team customizes glue products to help customers reduce costs and improve process quality. Glue products are delivered quickly and are environmentally friendly.

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Created on Oct 18th 2022 00:25. Viewed 67 times.

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