Everythings You Need to Know About Based Chip Underfill and COB Encapsulation Materials

by Hei White Heiwhite

DeepMaterial offers new capillary-flow subfills that are compatible with CSP devices Flip chips CSP devices, BGA and Flip chips. The latest capillary flow subfills consist of pot substances of superior purity that offer excellent fluidity. They can form homogenous layers of underfill and reduce solder stress, increasing the strength and durability of components. DeepMaterial can fill components with extremely small pitches quickly, with a high cure rates, as well as durable and long-lasting durability and also allowing for the possibility the possibility of the possibility of reworkability. Reworkability could help you save money as it permits the underfill of this board removed and then filled with a new one.

In the event of a prolonged thermal age and for a lengthy cycle Flipchip assembly requires relief from stress at the seams of welding. CSP and BGA assembly require use of an underfill to improve the structural strength when testing flexing drop strength or even vibration.

DeepMaterial's Based-Chip Underfills come with large filler content and quick flow even in small pitches. They are able to handle very high temperature for glass transition and also high modulus and the highest temperatures required for glass transition CSP underfills come with types of filler. Each level is selected according to the glass transition's temperature and the module.

COB is a great way to protect wire bonding and increase their durability. A secure seal for wire-bonded chips consists of cofferdam, gaps filling and the top Encapsulation. Adhesives need to be fine-tuned by Flow Functions. This ensures that the wires are secure and the adhesive will not spill out of the chip. This allows for precise pitch leads.

DeepMaterials COB encapsulating glues are thermally or UV-cured. DeepMaterials COB can also be thermally cure or UV curable, with high reliability. The waterproofing adhesives in DeepMaterial for COB ensure the safety of silicon wafers as well leads from mechanical and chemical destruction.

COB Encapsulation Materials DeepMaterial Adhesives were created through heating and UV-curing chemical. They offer excellent electrical insulation. DeepMaterial COB Encapsulation Materials offer exceptional high temperature stability and the ability to resist thermal stresses. They also possess excellent electrical insulation properties across the entire temperature range, and also have low shrinkage.

DeepMaterial, Ltd., located in Shenzhen is an innovative firm that specializes in adhesives for semiconductors as well as different electronic uses. It also provides protective coatings that protect chip packaging, test and packaging.

DeepMaterial It is built on the technology of adhesives which are its foundation. has developed adhesives that are used in testing and packaging of chips and circuit board-level adhesives, as well as adhesives for electronic devices. The company also developed protective films, sealing materials for semiconductors and packaging for processing semiconductor wafers. Get more info here: www.deepmaterialcn.com

Offer electronic adhesives and electronic applications on thin films and solutions for businesses who deal with communication terminals, as and consumer electronics companies semiconductor testing and packaging companies, and also manufacturers of communication equipment to resolve the issues mentioned above for customers who require high-precision process protection, bonding, and electrical performance. Protection requirements for domestic substitution in the form of and optical protection, and such.