World’s Leading Easy-to-use Automatic Back Grinding Machine | AM TECHNOLOGY
by Professional Writer Professional WriterAM Technology Co., Ltd. is the global leading
company in ceramic and glass abrasive processing equipment for semiconductor
industries and precision equipment industries and research institutes.
Its electrolytic dressing device and dicing saw
have its proprietary patented technology implemented.
AM Technology has committed to satisfy the
customers' needs since its establishment in 1994. With unwavering research and
development, AM Technology has gained trust from the customers by the superior
precision equipment with the merit of ease of use. Now its equipment is
available in India, China, Japan and Taiwan and around the globe.
AM Technology business area consists of three
business divisions. Those are P&L Division, D&G Division and Laser
Division. D&G Division operates the grinding process
business, Fly-cut process business, Dicing process business and Wax bonder process
business.
In the
grinding process section, AM Technology manufactures two kinds of grinding machines. Those are Semi
Auto Back
Grinding Machine and Full Auto Back
Grinding Machine.
Semi Auto Back Grinder Machine: It is a robust and simple structure machine. It has an auto workpiece thickness measuring system. Also, the auto dressing function is
available. The advantage of this machine is low breakage rate of the products
during processing. The easy operation and the process are managed by the
optimized software.
Full Auto Back Grinder Machine: It is a substantially simple structure machine. It has an automatic thickness measuring system. Also, the dressing system of
this machine is automatic. The advantage of this machine is the loading and unloading of the workpiece is automatic. And the cleaning and drying process is also automatic. The
operation and the process are very easily managed by the optimized software.
Applications of Semi Auto Back Grinding
Machine and Full Auto Back Grinding Machine of AM
Technology Co., Ltd.
ü It has
been mainly used in the Semiconductor Packaging industry and Wafer Processing
industry.
ü Also used
in Ceramic, Metal, Glass, Si ring,
Electrode, LED mold, Carbons and Plastics processing.
ü In
Semiconductor Packaging: Strip mold & Composite, Fan-out wafer level
package, PLP, PCB board and finger print.
ü In Wafer
Processing: Silicon wafer, Silicon Carbide wafer and
Sapphire.
Click here to contact AM
Technology.
View more: AM Technology Grinding Machine
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Created on Dec 15th 2021 05:54. Viewed 155 times.