World’s Leading Easy-to-use AutomaticBack Grinding Machine | AM TECHNOLOGY

by Professional Writer Professional Writer

AM Technology Co., Ltd. is the global leading company in ceramic and glass abrasive processing equipment for semiconductor industries and precision equipment industries and research institutes.

Its electrolytic dressing device and dicing saw have its proprietary patented technology implemented.

 

AM Technology has committed to satisfy the customers' needs since its establishment in 1994. With unwavering research and development, AM Technology has gained trust from the customers by the superior precision equipment with the merit of ease of use. Now its equipment is available in India, China, Japan and Taiwan and around the globe.

 

AM Technology business area consists of three business divisions. Those are P&L Division, D&G Division and Laser Division. D&G Division operates the grindingprocess business, Fly-cut process business, Dicing process business and Wax bonder process business.

 

In the grinding process section, AM Technology manufactures two kinds of grinding machines. Those are Semi Auto Back Grinding Machine and Full Auto Back Grinding Machine.

 

Semi Auto Back Grinder Machine: It is a robust and simple structure machine. It has an auto workpiece thickness measuring system. Also, the auto dressing function is available.The advantage of this machine is low breakage rate of the products during processing. The easy operation and the process are managed by the optimized software.

 

Full Auto Back Grinder Machine: It is a substantially simple structure machine. It has an automatic thickness measuring system. Also, the dressing system of this machine is automatic. The advantage of this machine is the loading and unloading of the workpiece is automatic. And the cleaning and drying process is also automatic. The operation and the process are very easily managed by the optimized software.

 

Applications of Semi Auto Back Grinding Machine and Full Auto Back Grinding Machine of AM

Technology Co., Ltd.

 

ü  It has been mainly used in the Semiconductor Packaging industry and Wafer Processing industry.

ü  Also used in Ceramic, Metal, Glass, Siring, Electrode, LED mold, Carbons and Plastics processing.

ü  In Semiconductor Packaging: Strip mold & Composite, Fan-out wafer level package, PLP, PCB board and finger print.

ü  In Wafer Processing: Silicon wafer, Silicon Carbide wafer and Sapphire.

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Created on Jan 3rd 2022 01:29. Viewed 197 times.

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