MJ A8 A9 A10 3D Tin Plant groove BGA Reballing Stencil

Groove 3D BGA Reballing Stencil template For Iphone A8 A9 A10

Option1: 1PC MJ 3D A8 + 1PC MJ 3D A9 + 1PC MJ 3D A10

Option2: 3PC MJ 3D A8

Option3: 3PC MJ 3D A9

Option4: 3PC MJ 3D A10

Thickness: 0.25mm

3D molding, thickening and hardening

3D stell Net unique groove Fixed IC, quick Positioning



MJ 3D A8 BGA Reballing Stencil: including iphone6/6 plus all need to plant Tin ic(touch ic, Wifi IC, Baseband, font

ic...etc), A8 upper and lower CPU

MJ 3D A9 BGA Reballing Stencil: including iphone6s/6s plus all need to plant Tin ic(touch ic, Wifi IC, Baseband, font

ic...etc), A9 upper and lower CPU

MJ 3D A1o BGA Reballing Stencil: including iphone7/7 plus all need to plant Tin ic(touch ic, Wifi IC, Baseband, font

ic...etc), A10 upper and lower CPU



Package List:

1 X MJ 3D A8 Tin Plant
1 X MJ 3D A9 Tin Plant
1 X MJ 3D A10 Tin Plant