New Arrive G-Lon Middle Board BGA Reballing Stenciby Nancy N. DIY diagnostic and car repair tools
G-Lon Middle Board BGA Reballing Stencil With Solder Paste. Phone X Middle Board Plant Tin Platform For Phone x Maintenance with exclusive pant tin kit designed. Recommended Features
- G-Lon Middle Board BGA Reballing Stencil
- Phone X Middle Board
- Phone x Maintenance
- Plant Tin Platform With Solder Paste
Review on New Arrive G-Lon Middle Board BGA Reballing StenciSunshine G-Lon Phone X Middle Board Plant Tin Platform With Solder Paste
G-Lon BGA Reballing Stencil package
Phone X Middle Board Plant Tin Platform description:
This set of tools breaks through the problem of low success rate of traditional mainboard repairing.
Greatly reduced the difficulty of motherboard maintenance.
The mystery lies in professionalism of the soldering paste. There is no different between this product and original middle layer tin. The tin melting point of the CPU area is slightly lower than the that of surrounding.
This solder paste uses the principle of temperature difference, Easily blow CPU without touching the peripheral accessories.
Within the fine temperature difference, Makes the entire maintenance efficiency greatly improved.
Even green hands can plant tin perfectly.
Related to New Arrive G-Lon Middle Board BGA Reballing Stenci
Created on Feb 15th 2019 02:47. Viewed 411 times.
No comment, be the first to comment.