Functions and types of electronic packaging

Depending on the encapsulating material, the electronic package may be divided into plastic packaging, ceramic packaging, and metal packages of three. Of which the latter two for hermetic package, mainly for the aerospace, aviation and military fields, and is widely used in plastic packaging civilian areas. Due to the low cost of materials of the plastic-encapsulated semiconductor chip, and is suitable for large-scale automated production of recent years, both transistors or integrated circuits are increasingly made ​​of plastic package, ceramic and metal packaging is rapidly reduced. Now, more than 90 percent of the semiconductor devices are used plastic packaging, plastic packaging materials and more than 90% of epoxy molding compound, indicating that epoxy molding compound has become one of the important pillars of the semiconductor industry.

Currently IC forward high integration, cabling miniaturization, chip and surface mount large-scale technological development, and this adaptation of plastic materials research and development trend is to make materials with high purity, low stress, low inflation, a low-rays, high heat and other performance characteristics. Select the principles used in plastic packaging resins are:

(1) in a wide temperature and frequency range, has excellent dielectric properties.

(2) has good heat resistance, cold resistance, moisture resistance, air resistance, radiation resistance and heat dissipation.

(3) a metal having a coefficient of thermal expansion substantially matches the non-metallic material, good adhesion.

(4) the rate of shrinkage during curing to be small, the size should be stable.

(5) contamination of the semiconductor surface of the device and can not have good processability.

  Epoxy molding compound is an epoxy resin and a curing agent component composed of a phenolic resin molding powder, which under the action of heat to become crosslinked or cured thermoset plastic, in the injection molding process which will be embedded in a semiconductor chip, and give it some structure shape, plastic encapsulated semiconductor devices become.

more information www.cnmoulding.com www.chinamoldmaker.org

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Created on Dec 31st 1969 18:00. Viewed 0 times.

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