Types and uses of sputtering targets in the electronic field
Sputtering targets have important
applications in many areas, such as architecture, optics, electronics and so
on. Sputtering targets used in electronic industry can be subdivided into
semiconductor target (also called anelva target), planar target, coated
glass target, solar photovoltaic target, and so on. There are some differences
in the selection and performance requirements of sputtering materials in
different application fields. Among them, anelva targets, the sputtering
targets used in semiconductor integrated circuits, are the most demanding and
strict.
The table below shows the main types, uses,
and performance requirements for sputtering targets in the electronics field.
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|
Type |
Application |
Main Variety |
Performance Reqiurment |
|
Semiconductor |
Used to prepare integrated circuit core
materials |
W, WTi, Ti, Ta, Al alloy with purity 4N
or 5N. |
Highest technical requirements;
ultra-high purity metal; high precision size; high integration |
|
Flat display |
Sputtering technology guarantees
uniformity of film produced, increases productivity and reduces costs |
Nb, Si, Cr, Mo, MoNb, Al alloy , Cu and
Cu alloy targets |
High technical requirements; high purity
materials; large material area; high uniformity |
|
Decoration |
Used for coating the surface of the
product for beautification, wear resistance and corrosion resistance. |
Cr, Ti, Zr, Ni, W, TiAl, CrSi, CrTi,
CrAlZr target |
General technical requirements; mainly
used for decoration, energy saving, etc. |
|
Tool |
Enhance the surface of tools and molds,
improve the life and the quality of the parts manufactured |
TiAl, CrAl, Cr, Ti, TiC, Al2O3 target |
High performance requirements; extended
service life |
|
Solar |
Sputter coating technology for the
production of fourth-generation thin-film solar cells |
ZnOAl, ZnO, ZnAl, Mo, CdS, CIGS target |
High technical requirements; large
application range |
|
Electron device |
Thin film resistors, film capacitors |
NiCr, NiCrSi, CrSi, Ta, NiCrAl target |
Requires small size, good stability, and
low temperature coefficient of resistance |
|
Information storage |
Used to make storage |
Cr alloy, Co alloy, CoFe alloy, Ni alloy |
High storage density; high transmission
speed |
Please visit https://www.sputtertargets.net/
for more information.
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