Types and uses of sputtering targets in the electronic field

by Julissa G. Content generator

Sputtering targets have important applications in many areas, such as architecture, optics, electronics and so on. Sputtering targets used in electronic industry can be subdivided into semiconductor target (also called anelva target), planar target, coated glass target, solar photovoltaic target, and so on. There are some differences in the selection and performance requirements of sputtering materials in different application fields. Among them, anelva targets, the sputtering targets used in semiconductor integrated circuits, are the most demanding and strict.

The table below shows the main types, uses, and performance requirements for sputtering targets in the electronics field. If it helps you, please share this article with your friends.



Main Variety

Performance Reqiurment


Used to prepare integrated circuit core materials

W, WTi, Ti, Ta, Al alloy with purity 4N or 5N.

Highest technical requirements; ultra-high purity metal; high precision size; high integration

Flat display

Sputtering technology guarantees uniformity of film produced, increases productivity and reduces costs

Nb, Si, Cr, Mo, MoNb, Al alloy , Cu and Cu alloy targets

High technical requirements; high purity materials; large material area; high uniformity


Used for coating the surface of the product for beautification, wear resistance and corrosion resistance.

Cr, Ti, Zr, Ni, W, TiAl, CrSi, CrTi, CrAlZr target

General technical requirements; mainly used for decoration, energy saving, etc.


Enhance the surface of tools and molds, improve the life and the quality of the parts manufactured

TiAl, CrAl, Cr, Ti, TiC, Al2O3 target

High performance requirements; extended service life


Sputter coating technology for the production of fourth-generation thin-film solar cells

ZnOAl, ZnO, ZnAl, Mo, CdS, CIGS target

High technical requirements; large application range

Electron device

Thin film resistors, film capacitors

NiCr, NiCrSi, CrSi, Ta, NiCrAl target

Requires small size, good stability, and low temperature coefficient of resistance

Information storage

Used to make storage

Cr alloy, Co alloy, CoFe alloy, Ni alloy

High storage density; high transmission speed


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About Julissa G. Innovator   Content generator

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Joined APSense since, August 14th, 2018, From Lake Forest/USA, United States.

Created on Oct 22nd 2018 01:03. Viewed 1,276 times.


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