WL Intelligent Grinding Equipment Fby vipfixphone Jon electronic
It is designed to grind and remove the CPU, Baseband, CHIP, HDD, WIFI, FONT chips in iPhone series mobile phone without any damage on the motherboard. Recommended Features
- 1 WL Grinding machine
- 1 iPhone motherboard mould: 6, 6P, 6S, 6SP, 7, 7P
- 1 Control box
- 1 Power cable
- 1 control line
Review on WL Intelligent Grinding Equipment FWL Intelligent Grinding Equipment is professional iPhone IC chip repair machine, It is designed to grind and remove the CPU, Baseband, CHIP, HDD, WIFI, FONT chips in iPhone series mobile phone without any damage on the motherboard. The smart ic grinding machine for iPhone is very convenient to be controlled and operated with LCD touch screen instead of computer, it can offer great service in mobile phone repairing and refurbishing.
WL Intelligent Grinding Equipment for iPhone IC CHIP Repair
WL iphone IC Grinding Machine is perfect to grind and remove the CPU, Baseband, CHIP, HDD, WIFI, FONT chips in iPhone series mobile phone without any damage in the board. It is effective machine to help you repair the iPhone 6, 6 plus, 6S, 6S plus, 7, 7 plus. You can use the soldering station to solder a good chip in the board after grinding. Great grinding machine in mobile phone repairing and refurbishing.
Intelligent WL Grinding Machine Set Included:
1 WL Grinding machine
1 iPhone motherboard mould: 6, 6P, 6S, 6SP, 7, 7P
1 Control box
1 Power cable
1 control line
1 Parallel port cable 25pin
1 Tool package
1x water pump
1x vacuum cleaner
many pcs Milling cutting tool
1x Full set second computer come with 17" monitor: pre-installed the professional controller software
If use BGA rework station or desoldering station.
1. BGA chip is difficult to be removed as soder ball melts but glue didn't.
2. uneven heat will damage the surrounding chip and PCB layers, heat especially will melt surrounded BGA chips solder point and cause short circuit.
If use IC grinding machine
1. we can engraving the whole chip and show the PCB pads.
2. PCB and chip may have tilt angle, it cause the engraving difficult to just cut a flat area, our smart IC remover has detector to check 4 corners of chip before engraving, we can then calculate the chips tilt angle.
3. Work without PC, just control the LCD touch screen we can easy to remove BGA chip.
4. No need to do glue removin
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Created on Apr 3rd 2018 21:51. Viewed 664 times.
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