fine pitch led display

by Luacs Juan project engineer

COB concise process minimizes failure factors and contributes to higher stability, larger heat dissipation area reduces chip overheat damage and extends the lifespan of LEDs.

Recommended Features

super viewing angle
fine pixel pitch (o.77-1.25mm)
anti-collision
excellent color expression
Ultra-High Reliability

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Review on fine pitch led display

FLIP-CHIP COB
Fli-chip COB is the process to die-bond the chip directly onto the PCB board, with no need for wire bonding, the simplified process contributes to less defect creation factor. bringing to high black occupancy and reliability.

Ultra-High Reliability
COB concise process minimizes failure factors and contributes to higher stability, larger heat dissipation area reduces chip overheat damage and extends the lifespan of LEDs.

Strong Protection
The circuit board, crystal particles, solder feet, and leads are fully sealed. , moisture resistance, anti-collision, prevention of pollution damage, and easier cleaning of the device surface.

Color Performance
COB Realizes The Conversion From Point Light Source To Surface Light Source No pixel graininess; reduce the light radiation, moir, suitable for close and long-term viewing

Hassle-Free Installation.
16:9 ratio cabinet, no need to stretch the video source. Easy and efficient installation, Complete front service, Perfect design produces a uniform installation across any setting with visionpi seamless splicing tech, eliminating gaps between frames or cabinets.

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