World’s best Polishing Machines to suit to Wafer processing | AM TECHNOLOGY

by Professional Writer Professional Writer

AM Technology Co., Ltd. is the global leading company in ceramic and glass abrasive processing equipment for semiconductor industries and precision equipment industries and research institutes.

AM Technology has committed to satisfy the customers' needs since its establishment in 1994.

With unwavering research and development, AM Technology has gained trust from the customers by the superior precision equipment with the easy-to-operatefeature. Nowits equipment is available in India, China, Japan and Taiwan and around the globe.

Its electrolytic dressing device and dicing saw have its proprietary patented technology implemented.


AM Technology consists of three business divisions.

Those are P&L Division, D&G Division and Laser Division.

The P&L Division operates three businesses. Those are the fine grinding process business, single side polishing process machine business and double side polishing process machine business.


AM Technology Single Side Polishing Machine


ü  It is a strong-structured machine

ü  It has a feature of automatic block index system

ü  It is optimized with a DMP/CMP Software

ü  It has a 5 steps control functions – pressure, speed and time

ü  It is equipped with Hydro static facing system for DMP

ü  It has an automatic pad cleaning system for CMP

ü  It suits to use forthe processing of Wafers (Si, Sic, Ceramic, GaAs and others)

ü  Dimension of single side polishing machine

36B4R ->DMP -> 1430(W) * 2340(D) * 2002(H)(mm)

36B4R ->CMP -> 1430(W) * 1620(D) * 2162(H)(mm)

50B4R ->DMP -> 2260(W)* 3244(D) * 2830(H)(mm)

50B4R ->CMP -> 2120(W) * 2700(D) * 2863(H)(mm)


AM Technology Double Side Polishing Machine


ü  It is a anti vibration design

ü  It is an optimized frame for double-side CMP

ü  It is equipped with Hydro static facing unit for DMP

ü  It has a self-reconditioning to save time for DMP

ü  It is equipped with Optimized pressure control system

ü  It is optimizedwith DMP/CMP software

ü  It suits to use forthe processing of Wafers (Si, Sic, Ceramic, GaAs and others)

ü  Dimension of double side polishing machine

ADP-1605 ->DMP->1820(W)*3050(D)*2520(H) (mm)

ADP-1605 ->CMP->1820(W)*2730(D)*2520(H) (mm)


Click here to contact AM Technology.


View more:AM Technology Polishing Machine


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Created on Nov 30th 2021 00:32. Viewed 158 times.


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