Failure Analysis Equipment Market Analysis And Forecast 2014 - 2020

by Wayne Collins Research Analyst

The global failure analysis equipment market in semiconductor industry was valued at USD 1.28 billion in 2013, growing at a CAGR of 4.5% from 2014 to 2020.

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Rising investments in research and education infrastructure across the globe coupled with robust growth in the semiconductor industry are propelling the global failure analysis equipment market in semiconductor industry. However, high cost of failure analysis equipment leads to their low adoption rate, especially in cost sensitive countries of the Asia Pacific region. This hinders the growth of the failure analysis equipment market to an extent. However, emerging innovative techniques such as SQUID, SDR, EMMI, XIVA and OBIRCH are excellent opportunities which are expected to bolster the failure analysis equipment market in the semiconductor industry over the years to come.

Transmission electron microscope (TEM) and focused ion beam system (FIB) accounted for USD 0.39 billion and USD 0.29 billion in the year 2013, respectively, owing to extensive usage of these equipment. However, dual beam systems (FIB/SEM) are expected to grow at the fastest pace in the coming years due to their advantages over a single-beam FIB system, especially for sample preparation and microscopy applications, in which the ion beam can be used for site-specific material removal and the SEM for nondestructive imaging and analysis. Moreover, using the dual beam system for defect review on wafers helps find and section defects too small to see with optical microscopes. The dual beam systems segment is expected to grow at a CAGR of 5.8% over the forecast period.

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Transmission Electron Microscopy technology offers highly sensitive elemental analysis and superior spatial resolution capabilities which are extensively used in advanced semiconductor technologies for material characterization. The technique is used for failure analysis, physical characterization, and compositional analysis of semiconductor devices. Scanning Electron Microscopy is one of the most widely used technologies as it can provide extremely detailed images. The technique is majorly used in failure analysis, process characterization, dimensional analysis, particle identification and reverse engineering. Other failure analysis technologies such as nanoprobing, X-ray microscopy, and reactive ion etching are expected to witness healthy growth during the forecast period of 2014 to 2020.

Reduction in particle sizes owing to rapid advancements in semiconductor technology has driven the need for defect localization in failure analysis. For the purpose of defect localization, technologies such as emission microscopy and laser-based techniques such as OBIRCH, TIVA and LIVA are increasingly being used. Thus, the market for defect localization is expected to grow at a CAGR of 5.2% during the forecast period.

Fab failure analysis (FA) labs offer world-class analysis with the help of experienced and multi-disciplinary analysis teams, which use advanced toolsets/equipment. These labs generally provide a large number of failure analysis solutions and manufacture a number of products/components using multiple failure analysis equipment. Thus, the segment is also expected to continue with its dominance and grow at a CAGR of 5.8% over the forecast period. Specialty labs and others customer segments collectively accounted for over 30% of the global market share.

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In 2013, Asia Pacific was the largest revenue generator that accounted for 55.39% of the total market share. The dominance by Asia Pacific is due to immense growth in semiconductor technologies in Asia Pacific countries coupled with increased investments in education and research infrastructure. Furthermore, rising demand for consumer electronics such as smart phones, tablets etc. are further expected to boost the growth of failure analysis equipment in the region. North America and Europe collectively accounted for over one-third of the market share. Both the regions are facing unfavorable government regulations which are hindering growth of the market in the regions.

The key market participants in the industry include FEI, Hitachi High-Technologies Corporation, Carl Zeiss SMT GmbH, and JEOL Ltd. The report provides an overview of these companies followed by their product portfolio, financial revenue, business strategies, and recent developments.

This research report analyzes and estimates the performance and market of failure analysis equipment in semiconductor industry in the global scenario, providing detailed trend analysis of the market by geography and comprehensive analysis of companies that are dealing in failure analysis equipment. The report presents a thorough assessment of the strategies followed by different stakeholders by segmenting the failure analysis equipment market as below:

Failure analysis equipment market in semiconductor industry: By geography

North America
Europe
Asia Pacific
RoW

Failure analysis equipment market in semiconductor industry: By equipment

Scanning electron microscope (SEM)
Transmission electron microscope (TEM)
Focused Ion Beam system (FIB)
Dual Beam (FIB/SEM) systems

Failure analysis equipment market in semiconductor industry: By technology

Transmission electron microscopy
Scanning electron microscopy
Scanning Transmission electron microscopy (STEM)
X-ray imaging
Nanoprobing
Laser voltage imaging (LVI)
Focused ion beam (FIB)
Broad ion milling (BIM)
Secondary ion mass spectroscopy (SIMS)

Energy dispersive X-ray spectroscopy (EDX)
Reactive ion etching (RIE)
Chemical mechanical planarization (CMP)

Failure analysis equipment market in semiconductor industry: By application

Defect localization
Defect characterization
Others

Failure analysis equipment market in semiconductor industry: By customers

Fab FA labs
Fabless FA labs
Specialty labs
Others

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