Cheap Price With Best Quality Bios Programmer With Full Warranty

We sell reliable bios programmer imported from across the world .We sell two types of bios programmer . For sales enquiry call 011-47592046/9971004998 CHIPTRONIKS stocks BGA Reballing Kit of all brands which are running.VD Intellisys Technologies Pvt. Ltd. is the authorized distributor for products of Jovy Systems ( BGA Machines and its accessory) in India .Our division Intellisys Overseas sells these machines in India . Our commitment is prompt business service together with unmatched quality in this sector. We represent world leading companies in this sector and help in achieving global standards in India . We have also a full fledged repairing chain CHIPMENTOR and we also provide training on repairing electronic products via  CHIPTRONIKS .

CHIPTRONIKS offers Laptop Spare Parts of all brands which are running.VD Intellisys Technologies Pvt. Ltd. is the authorized distributor for products of Jovy Systems ( BGA Machines and its accessory) in India . Our division Intellisys Overseas sells these machines in India .Our commitment is prompt business service together with unmatched quality in this sector. We represent world leading companies in this sector and help in achieving global standards in India . We have also a full fledged repairing chain CHIPMENTOR and we also provide training on repairing electronic products via  CHIPTRONIKS .

BGA (Ball Grid Array) rework station in india. A well known name for BGA supplier in india,delhi,ncr region;Leading after sales provider in IT Industry .

 Mini Bios Programmer :

 Mini Bios Programmer is a flashrom programmer used fro modern laptops/desktops motherboards.It has simple Hardware and software usage and very low price.

Lead-free alloys such as SAC alloys have slight higher surface tensions when compared to 63/37. It is important to select a solder paste which has a flux chemistry designed for the higher preheats and peak temperatures. Choosing a solder paste, which does not contain resins and activators which decompose at these higher temperatures is the primary factor in void reduction. Good solder paste manufacturers are deigning flux systems for lead-free alloys.The voiding potential information is often available for use during the paste selection process.

Optimizing the reflow profile as to remove any volatiles by extending the preheat times and increasing the time above liquidus will also help in reducing void entrapment. Insuring components and boards are free of moisture and plating contaminants will also help to reduce voids. It has been shown that copper OSP tends to produce slightly higher volume of voids when compared to Ni/Au and silver immersion, which produce much less.

In some cases joint geometories are  contributors. Components such as leadless  chip carries or large flat surfaces , perpendicular to the board will prevent out-gassing during the soldering process ; this results in void increases. Solder flux by-products both.