eMMC Test socket adapter for memory vendors

by Milo Yin
universal BGA socket that is designed for all eMMC Packages from major memory vendors such as Samsung, Hynix, Toshiba, Sandisk, Micron, etc. has recently introduced universal high performance BGA socket for high speed testing of the memory devices during the design and application development phase. 

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eMMC acronym for Embedded Multi Media Card describes an architecture consisting of an embedded storage solution with MMC interface, flash memory and controller, all in a small ball grid array(BGA) package. These eMMC memory devices cover a wide area of applications such as smart phones, cameras, tablet computers, digital recorders, MP3 players, electronic toys, etc. that needs high mobility and high performance at a low cost. Other features include low power consumption and high data throughput at the memory card interface. According to iSuppli research, the evolution of eMMC has been fast with phenomenal enhancements to performance. eMMC 4.5 specifically addresses several new capabilities such as increased longevity, doubling memory transfer speeds, addition of volatile cache enabling faster performance, etc. This means testing these eMMC devices can be possible only by using high speed interconnects.

For almost MOVINAND/iNAND/EMMC memory chip:

For iPones 4/5/6 Flash memory:  VBGA11P5P  / VBGA134SP / LGA52P Test Socket
For Cool cell / Collpad phone:   VBGA56P / VBGA221P Test Socket
For 8530 Samsung others phones: VBGA153P Test Socket
For Samsung 9100/9300/9500/NO4/mi..: VBGA169P Test Socket
For HTC / Mi / 8721 Phones: VBGA162P Test Socket

For other newer phones, smartphones and tablets,  BlackBerrys: SBGA128P Test Socket, SBGA137NP Test Socket, SBGA152P Test Socket, SBGA188P / SBGA188AP / SBGA188BP Test socket, SBGA199P Test Socket, SBGA202P Test Socket, FBGA167 Test Socket.

GHz BGA Socket
universal BGA socket is designed for testing eMMC BGA device and operates at bandwidths up to 10 GHz with less than 1dB of insertion loss. The contact resistance is typically 20 milliohms per pin. The BGA socket connects all pins with 10 GHz bandwidth on all connections. The BGA socket is mounted using supplied hardware on the target PCB with no soldering, and uses smallest footprint in the industry. The BGA socket also incorporates a new quick insertion method using shoulder screws and swivel socket lid so that IC's can be changed out quickly. The BGA socket also features floating compression mechanism to accommodate package manufacturing variations. The application of the BGA socket is to verify the function of eMMC device that provides a flexible, industry-standard architecture that simplifies mass storage designs for portable consumer electronics products based upon the industry-standard MMC System Specification v4.5 and JEDEC MO-276 BGA packaging standards. The specific package size accommodated by the BGA socket is shown in table below.

About Milo Yin Innovator

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Joined APSense since, March 1st, 2016, From shenzhen, China.

Created on Dec 31st 1969 19:00. Viewed 0 times.


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