MJ A8 A9 A10 3D Tin Plant groove BGA Reballing Stencil
by Nancy N. DIY diagnostic and car repair toolsGroove 3D BGA Reballing Stencil template For Iphone A8 A9 A10
Option1: 1PC MJ 3D A8 + 1PC MJ 3D A9 + 1PC MJ 3D A10
Option2: 3PC MJ 3D A8
Option3: 3PC MJ 3D A9
Option4: 3PC MJ 3D A10
Thickness: 0.25mm
3D molding, thickening and hardening
3D stell Net unique groove Fixed IC, quick Positioning
MJ 3D A8 BGA Reballing Stencil: including iphone6/6 plus all need to plant Tin ic(touch ic, Wifi IC, Baseband, font
ic...etc), A8 upper and lower CPU
MJ 3D A9 BGA Reballing Stencil: including iphone6s/6s plus all need to plant Tin ic(touch ic, Wifi IC, Baseband, font
ic...etc), A9 upper and lower CPU
MJ 3D A1o BGA Reballing Stencil: including iphone7/7 plus all need to plant Tin ic(touch ic, Wifi IC, Baseband, font
ic...etc), A10 upper and lower CPU
Package List:
1 X MJ 3D A8 Tin Plant
1 X MJ 3D A9 Tin Plant
1 X MJ 3D A10 Tin Plant
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Created on Dec 31st 1969 18:00. Viewed 0 times.